Integrally formed bake plate unit for use in wafer...

Details Integrally formed bake plate unit for use in wafer... Integrally formed bake plate unit for use in wafer...

2005-05-10

2005-05-10

Paik, Sang (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S444100

Reexamination Certificate

active

06891134

ABSTRACT:
A bake plate is integrally formed from a copper disk whose lower surface defines a desired heater element channel pattern that is filled with electrically conductive resistive material. Copper contamination is prevented by coating the structure. The channel pattern and fill material may be tailored to optimize thermal uniformity across the bake plate surface, and to produce a bake plate that may be mass produced with substantially uniform and repeatable thermal characteristics.

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