Integral-type ceramic circuit board and method of producing...

Details Integral-type ceramic circuit board and method of producing... Integral-type ceramic circuit board and method of producing...

2006-10-31

2006-10-31

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

Reexamination Certificate

active

07130174

ABSTRACT:
A substrate for mounting an electronic component, including a baseplate having a main surface formed with or without a recess. A ceramic substrate is provided on the main surface of the baseplate and has a smaller size than the baseplate. A metal layer is provided to cover both of the baseplate and the ceramic substrate. The metal layer has a surface remote from the baseplate and the ceramic substrate is made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. Thereby, an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability, can be realized.

REFERENCES:
patent: 5406029 (1995-04-01), Cook
patent: 6003221 (1999-12-01), Sawtell et al.
patent: 11-130568 (1999-05-01), None
patent: 11-140560 (1999-05-01), None
patent: 2000-277953 (2000-10-01), None

Affiliated with

Also associated with

Rating

Integral-type ceramic circuit board and method of producing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integral-type ceramic circuit board and method of producing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integral-type ceramic circuit board and method of producing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3685727