Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-12-09
1997-11-04
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439225, H01R 909
Patent
active
056832567
ABSTRACT:
An integral thru-hole contact is provided for solderless connection of a pin inserted therein. The integral contact provides for an interconnect board of extremely low profile for interconnection with an IC package or sockets or pin grid array sockets and may provide for power/ground decoupling or voltage conversion and upgrading of microprocessors.
REFERENCES:
patent: 4494172 (1985-01-01), Leary et al.
patent: 4519658 (1985-05-01), Biswas
patent: 4676564 (1987-06-01), Mitchell, Jr.
patent: 5290191 (1994-03-01), Foreman et al.
IBM Technical Disclosure Bulletin:Roche et al., Circuit Board Connective Scheme vol. 6, No. 8 p. 87 Jan. 8, 1964.
Abrams Neil
Byrd Eugene G.
Methode Electronics Inc.
Newman David L.
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