Integral semiconductor wafer map recording

Fishing – trapping – and vermin destroying

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437 7, 324158R, H01L 2166

Patent

active

052565785

ABSTRACT:
A method for integral semiconductor wafer map recording which comprises a semiconductor wafer (11) having a plurality of individual die (12, 13) thereon. Testing each of the individual die (12). Summarizing the results of the testing in a wafer map. Recording the wafer map on the semiconductor wafer (11) by laser scribing a binary code (19) within inactive die (13).

REFERENCES:
patent: 4829014 (1989-05-01), Yerman
patent: 4855253 (1989-08-01), Weber
patent: 5039602 (1991-08-01), Merrill et al.

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