Integral power and ground structure for multi-chip modules

Details Integral power and ground structure for multi-chip modules Integral power and ground structure for multi-chip modules

1993-07-09

1994-10-04

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361729, 361748, 361799, 361810, 174255, 257700, H05K 702

Patent

active

053531957

ABSTRACT:
A multi-chip module includes a substrate supporting a plurality of chips. A dielectric layer which overlies the chips and the substrate has a connection surface and a substrate surface with metallization planes having plane openings patterned on each surface and vias aligned with predetermined pads on the chips and predetermined portions of the metallization plane of the substrate surface. An adhesive layer is situated between the substrate and the substrate surface of the dielectric layer, and a pattern of electrical conductors extends through the vias to interconnect selected chips and selected portions of the metallization planes. In a related design, the dielectric layer may be a board having chip openings and conductive through-connections aligned with predetermined portions of the metallization plane of the substrate surface. The board can be thick enough that chip wells are not necessary for each chip, in which case, a base dielectric layer having vias aligned with chip pads, through-connections and the connection surface overlies the board and supports a pattern of electrical conductors which interconnect the chips and metallization planes.

REFERENCES:
patent: 4613891 (1986-09-01), Ng et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5154793 (1992-10-01), Wojnarowski et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5172303 (1992-12-01), Bernardoni et al.

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