Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-04-07
1998-06-23
Jackson, Jerome
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438 54, 438118, H01L 2160, H01L 2100
Patent
active
057704783
ABSTRACT:
An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module. A preferred cooling plate comprises a bead blasted roughened surface or plurality of criss-crossing channels forming protrusions having a width of less than about 1 mm and a channel width of about 1 mm to 5 mm.
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Iruvanti Sushumna
Klepeis Martin
Messina Gaetano Paolo
Sherif Raed
Ahsan Aziz M.
Arroyo Teresa M.
International Business Machines - Corporation
Jackson Jerome
Tomaszewski John J.
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