Integral lid/clamp for high power transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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Details

257719, 257727, 257732, 257731, 257704, 257718, H01L 2302, H01L 2312, H05K 720

Patent

active

058501045

ABSTRACT:
An integral semiconductor package and mounting structure in which a lid for sealing a semiconductor chip on a platform includes flanges extending beyond the platform with the flanges having holes for receiving screws for mounting the package to a heat sink. The flanges are flexed into engagement with a heat sink thereby maintaining the package in yieldable pressure engagement with the heat sink.

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