Integral heat sink-terminal member structure of hybrid integrate

Details Integral heat sink-terminal member structure of hybrid integrate Integral heat sink-terminal member structure of hybrid integrate

1992-09-23

1994-03-01

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361723, 257669, 257675, H05K 720

Patent

active

052913724

ABSTRACT:
An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate.

REFERENCES:
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patent: 3836825 (1974-09-01), Hall et al.
patent: 4521828 (1985-06-01), Fanning
patent: 4949220 (1990-08-01), Tashiro
patent: 5053855 (1991-10-01), Michii et al.
patent: 5065281 (1991-11-01), Hernandez et al.
Film on Metal Leaded Chip Carrier, Jun. 1988, pp. 2-4, IBM Technical Disclosure Bulletin, vol. 31, No. 1.

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