Integral fiber optic printhead

Details Integral fiber optic printhead Integral fiber optic printhead

1989-04-03

1990-12-04

Gonzalez, Frank

35022724, 35022726, 35022728, G02B 608

Patent

active

049749285

ABSTRACT:
An integral sensing head includes a single fiber optic faceplate substrate to which are connected photodiode arrays, circuits for selectively controlling the transmission of electronic information signals from the photodiodes and interconnecting conductive lines all disposed on the same fiber optic faceplate substrate which thereby provides the optical lens system for the photodiodes and a supporting substrate to which the active components are mounted and electrically interconnected by conductive lines.

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A New LSI Bonding Technology "Micron Bump Bonding Assembly Technology", by K. Hatada et al., 5th IEEE/CHMT International Electronic Manufacturing Technology Symposium-Design-to-Manufacturing Transfer Cycle, Proceedings Date: Oct. 10-12, 1988, pp. 23-27.
A New Technology, "Insulation Resin Bonding-Chip on Substrate Assembly Technology", by Kenzo Hatada et al., Semiconductor Reserach Center, Matsushita Electric Industrial Co., Ltd.

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