Integral extended surface cooling of power modules

Details Integral extended surface cooling of power modules Integral extended surface cooling of power modules

1992-12-23

1994-09-20

Thompson, Gregory P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 165 804, 257714, 361699, 361707, H05K 720

Patent

active

053494989

ABSTRACT:
The semiconductor wafer of the power module is mounted directly, separated only by thermal expansion control layers and insulator layers, on the metal base which has fins or pins integrally formed thereon. This module is mounted on a coolant fluid flow chamber so that the module mounting is not a thermal interface. In this way, maximum power module cooling is achieved with minimum fluid flow.

REFERENCES:
patent: 3788393 (1974-01-01), Plizak
patent: 4652970 (1987-03-01), Watari et al.
patent: 4782893 (1988-11-01), Thomas
patent: 4805691 (1989-02-01), Cook et al.
patent: 5043845 (1991-08-01), McDermott et al.
patent: 5046552 (1991-09-01), Tousignant
patent: 5070936 (1991-12-01), Carroll et al.

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