Integral electric module and assembly jet cooling system

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

165DIG11, 361383, 361415, H05K 720

Patent

active

043994849

ABSTRACT:
An improved printed circuit board housing assembly is described wherein localized high intensity cooling of heat dissipating electronic components mounted on the circuit boards may be accomplished by direct impingement of streams of fluid coolant onto individual components; when coolant is passed through the housing, fluid streams, generated at openings provided in the circuit boards, impinge onto electronic components mounted on the next circuit board downstream from the source of coolant flow.

REFERENCES:
patent: 2187011 (1940-01-01), Braden
patent: 2843806 (1958-07-01), O'Neill
patent: 3626251 (1971-12-01), Vigue
patent: 3843910 (1974-10-01), Rinquet
patent: 3844343 (1974-10-01), Burgraff
patent: 3967874 (1975-09-01), Calabro
patent: 4006388 (1977-02-01), Bartholomew
patent: 4122508 (1978-10-01), Rumbaugh

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