Integral dielectric heatspreader

Details Integral dielectric heatspreader Integral dielectric heatspreader

2001-04-09

2002-07-02

Ohervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C361S708000, C361S713000, C361S719000, C361S760000, C361S761000, C257S706000, C257S707000, C257S713000, C165S080200, C165S185000

Reexamination Certificate

active

06414847

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention pertains to the field of microelectronic device packaging, more specifically, to packaging and mounting of heat dissipating microelectronic devices.
2. Art Background
Electronic systems typically include semiconductor devices which dissipate heat during normal operation. In RF and microwave electronics, examples include small compound devices such as Gallium Arsenide (GaAs) amplifiers and mixers. Many digital devices, such as prescalers and high speed integrated circuits also generate heat. Device performance and reliability is directly related to how efficiently heat can be extracted from them. An additional concern with RF and microwave devices is the necessity to carefully control the dimensions of conductors near the device, as these conductors affect performance of the system.
SUMMARY OF THE INVENTION
A dielectric heatspreader formed from a thermally conductive, electrically insulating substrate is used to mount high power semiconductor devices to a printed circuit board. The dielectric heatspreader may contain additional components and features such as passive components or transmission lines. The dielectric heatspreader provides thermal transfer between the semiconductor device and a printed circuit board. Thermal performance of the printed circuit board may be improved by providing thermal vias which provide additional heat transfer from the dielectric heatspreader.


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patent: 6058013 (2000-05-01), Christopher et al.
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patent: 6191477 (2001-02-01), Hashemi
patent: 6226183 (2001-05-01), Weber et al.
patent: 6301114 (2001-10-01), Ootani et al.

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