Integral copper column with solder bump flip chip

Details Integral copper column with solder bump flip chip Integral copper column with solder bump flip chip

1996-09-12

1998-08-04

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361749, 361767, 361774, 257737, 257738, 257747, 257778, H05K 720

Patent

active

057903778

ABSTRACT:
The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip.

REFERENCES:
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patent: 5346857 (1994-09-01), Scharr et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5642261 (1997-06-01), Bond et al.
Clearfield et al, "A Single Top Surface Metallurgy for Solder Flip Chip, Wirebond and TAB Interconnections" ISHM '94 Proceedings, pp. 485-490.
Kloeser et al, "Cost Effective Flip-Chip Interconnections on FR-4 Boards", ISHM '94 Proceedings, pp. 491-500.
Goldmann, "Geometric Optimization of Controlled Collapse Interconnections", Geometric Optimization of Interconnections, May 1969, pp. 251-265.
Guo et al, "Effect of Composition on the Low-Cycle Fatigue of Pb Alloy Solder Joints," Alpha Metals Inc. Catalog (1985) p. 5--IEEE #0569 5503/9010000-0496; pp. 496-504.

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