Integral bump technology sense resistor

Details Integral bump technology sense resistor Integral bump technology sense resistor

1999-06-22

2000-07-18

Easthom, Karl

Electrical resistors

With base extending along resistance element

Resistance element coated on base

307322, 361763, 361811, 257684, 257724, H01L 1012

Patent

active

060913185

ABSTRACT:
A metalization layer formed as part of a bump connection/flip chip process for a semiconductor circuit is also used to form a sense resistor or other passive components. The metalization layers normal composition can also be altered so as to change or control the value of the so formed resistor or to improve the temperature stability of the resistor. Other passive components such as capacitors or inductor can also be formed in this layer.

REFERENCES:
patent: 3654580 (1972-04-01), Laisi
patent: 4019168 (1977-04-01), Collins
patent: 4738871 (1988-04-01), Watanabe et al.
patent: 5485138 (1996-01-01), Morris
patent: 5654676 (1997-08-01), Avanic et al.
patent: 5712613 (1998-01-01), Bunkner et al.
patent: 5729438 (1998-03-01), Pieper et al.

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