Integral bonding attachment

Electrical connectors – With insulation other than conductor sheath – Terminal connector having insulating tube or sleeve adapted...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S523000, C439S932000, C439S741000, C439S877000, C439S883000, C439S878000, C439S810000, C439S880000, C439S882000

Reexamination Certificate

active

07896712

ABSTRACT:
An integral bonding attachment includes an insulated section of a conductive wire with an exposed, uninsulated section. A sleeve covers the insulated and uninsulated sections of the conductive wire, and the sleeve includes a flattened section encasing at least a portion of the uninsulated wire section to form a generally integral structure with the core of the conductive wire. At least one generally tubular section is positioned at an end of the flattened section to engage the insulated section of the conductive wire. An aperture may pass simultaneously through the inner core and flattened sleeve section for attaching the integral bonding attachment to a structure.

REFERENCES:
patent: 2804602 (1957-08-01), Vizcarrondo
patent: 2807792 (1957-09-01), O'Keefe et al.
patent: 2901722 (1959-08-01), Arnott, Jr.
patent: 3281524 (1966-10-01), Lynch, Jr. et al.
patent: 3291894 (1966-12-01), Sampson
patent: 3601783 (1971-08-01), Loose
patent: 3619481 (1971-11-01), Smith
patent: 3805221 (1974-04-01), Kuo
patent: 3955044 (1976-05-01), Hoffman et al.
patent: 3956823 (1976-05-01), Kuo
patent: 4072041 (1978-02-01), Hoffman et al.
patent: 4578088 (1986-03-01), Linscheid
patent: 4584429 (1986-04-01), Raketti et al.
patent: 4631631 (1986-12-01), Hodges et al.
patent: 4666227 (1987-05-01), Galizia et al.
patent: 4677255 (1987-06-01), Cumley
patent: 4693688 (1987-09-01), Cembruch et al.
patent: 4698456 (1987-10-01), Hamacher
patent: 4703221 (1987-10-01), Ochoa et al.
patent: 4717354 (1988-01-01), McCleerey
patent: 4737601 (1988-04-01), Gartzke
patent: 4772231 (1988-09-01), Hayes
patent: 4840585 (1989-06-01), Muzslay
patent: 4895534 (1990-01-01), Klunk et al.
patent: 4965409 (1990-10-01), Lindroos
patent: 5033187 (1991-07-01), Gloe et al.
patent: 5106319 (1992-04-01), Julian
patent: 5106329 (1992-04-01), Maeshima et al.
patent: 5135418 (1992-08-01), Hatagishi et al.
patent: 5181867 (1993-01-01), Rodondi et al.
patent: 5263880 (1993-11-01), Schwarz et al.
patent: 5350316 (1994-09-01), Van Wagener et al.
patent: 5407371 (1995-04-01), Chen
patent: 5413509 (1995-05-01), Castaldo
patent: 5499448 (1996-03-01), Tournier et al.
patent: 5548089 (1996-08-01), Yamat
patent: 5613885 (1997-03-01), Plate et al.
patent: 5662503 (1997-09-01), Castaldo
patent: 5722991 (1998-03-01), Colligan
patent: 5762509 (1998-06-01), Kang
patent: 5762526 (1998-06-01), Kuramoto et al.
patent: 5823833 (1998-10-01), Castaldo
patent: 5879181 (1999-03-01), Okabe
patent: 5929373 (1999-07-01), Schiavo et al.
patent: 5938487 (1999-08-01), Henry et al.
patent: 6033255 (2000-03-01), Murofushi
patent: 6066007 (2000-05-01), Huang
patent: 6132264 (2000-10-01), Egenolf
patent: 6257920 (2001-07-01), Finona et al.
patent: 6305975 (2001-10-01), Steiner
patent: 6331742 (2001-12-01), Renkes et al.
patent: 6338637 (2002-01-01), Muench, Jr. et al.
patent: 6369474 (2002-04-01), Tanaka et al.
patent: 6500032 (2002-12-01), Endo et al.
patent: 6517366 (2003-02-01), Bertini et al.
patent: D475022 (2003-05-01), Kihira et al.
patent: 6604403 (2003-08-01), Eslambolchi et al.
patent: 6672910 (2004-01-01), Hotea
patent: 6753475 (2004-06-01), Takahashi et al.
patent: 6812404 (2004-11-01), Martinez
patent: 6843685 (2005-01-01), Borgstrom et al.
patent: 6905376 (2005-06-01), Chen
patent: 6929492 (2005-08-01), Bertini et al.
patent: 6976889 (2005-12-01), Kuwayama et al.
patent: 7174633 (2007-02-01), Onuma
patent: 7479316 (2009-01-01), Duke et al.
patent: 2002/0142677 (2002-10-01), Hosaka et al.
patent: 05049114 (1993-02-01), None
Eight-page International Search Report and Written Opinion from Counterpart International Application No. PCT/US2006/048871, now Publication now WO2007/075934, published Jul. 5, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integral bonding attachment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integral bonding attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integral bonding attachment will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2748737

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.