Intaglio printing method, intaglio printer, method of formation

Details Intaglio printing method, intaglio printer, method of formation Intaglio printing method, intaglio printer, method of formation

1998-02-20

2000-08-29

Asher, Kimberly

Printing

Intaglio

Processes

101483, 428901, 427 96, 29829, 29846, B41M 110, H05K 300, H05K 302, H05K 310

Patent

active

061091758

ABSTRACT:
An intaglio printing method and an intaglio printer are proposed, which are suitable for forming a wiring pattern and/or bumps such as bump electrodes on a print receiving material on which printing is to be performed, such as a substrate and a semiconductor package, using a paste or a fused metal. In addition, a method of forming the wiring pattern and the bumps such as bump electrodes on the printing substrate, using the intaglio printing method, a method for forming a wiring pattern, an apparatus for carrying out the method of forming the wiring pattern, the bump electrode and the wiring pattern are proposed.

REFERENCES:
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patent: 4908346 (1990-03-01), Strom et al.
patent: 4934714 (1990-06-01), Lynch
patent: 5209873 (1993-05-01), Yamamoto et al.
patent: 5227223 (1993-07-01), Morgan et al.
patent: 5362513 (1994-11-01), Shimada et al.
patent: 5366760 (1994-11-01), Fujii et al.
patent: 5882722 (1999-03-01), Kydd
Patent Abstract of Japan, vol. 095, No. 010, Nov. 30, 1995, JP 07 169635, Jul. 4, 1995.

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