Insulation sheet and apparatus utilizing the same

Details Insulation sheet and apparatus utilizing the same Insulation sheet and apparatus utilizing the same

2006-07-25

2006-07-25

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000

Reexamination Certificate

active

07081670

ABSTRACT:
An insulation sheet is formed by a heat conductive filler of an amount of 70–93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.

REFERENCES:
patent: 5569684 (1996-10-01), Okami et al.
patent: 6169142 (2001-01-01), Nakano et al.
patent: 6174841 (2001-01-01), Yamada et al.
patent: 6555905 (2003-04-01), Yamada et al.
patent: 6649258 (2003-11-01), Yamada et al.
patent: 6884660 (2005-04-01), Tetsuka et al.
patent: 2004/0106717 (2004-06-01), Asaine
patent: 2005/0161210 (2005-07-01), Zhong et al.
patent: 2001-110985 (2001-04-01), None

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