Insulation material of reactive elastomer, epoxy resin,...

Details Insulation material of reactive elastomer, epoxy resin,... Insulation material of reactive elastomer, epoxy resin,...

2011-07-19

2011-07-19

Sellers, Robert (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C714S738000, C428S416000, C525S065000, C525S109000, C525S113000

Reexamination Certificate

active

07981963

ABSTRACT:
In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.

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Wikipedia definition of cyanate, 2010, one page.

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