Insulation material for use in high-frequency electronic parts

Details Insulation material for use in high-frequency electronic parts Insulation material for use in high-frequency electronic parts

2005-05-03

2005-05-03

Woodward, Ana (Department: 1711)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C427S372200, C428S473500, C525S180000

Reexamination Certificate

active

06887525

ABSTRACT:
To provide an insulating material that has low dielectric constant and low dielectric loss tangent, and is superior in its processability into thin film. An insulating material for use in high-frequency electronic parts comprising: a matrix component composed at polyimide, and fluorocarbon resin particles uniformly dispersed therein.

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