Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1993-12-17
1995-04-04
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428210, 428901, B32B 900
Patent
active
054036518
ABSTRACT:
An insulating substrate for mounting semiconductor devices that is composed of a thin flat plate of inexpensive alumina (Al.sub.2 O.sub.3) preferably in the range of 0.26 to 0.29 mm in thickness. Copper foil sheets are applied to both sides of the flat plate with edges spaced a distance back from the end surface of the plate to increase air path distance between the edges of the sheets of foil applied to opposite sides of the plate. The difference in distance between the end surface of the alumina plate and the edges of each copper foil is 0.5 mm or less to balance thermal stress upon heating and cooling of semiconductors soldered to the copper foil.
REFERENCES:
patent: 4563383 (1986-01-01), Kuneman
patent: 4696851 (1987-09-01), Pryor
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5043223 (1991-08-01), Kugamai
patent: 5100714 (1992-03-01), Zsamboky
patent: 5153077 (1992-10-01), Kashiba
Topfer "Thick-Film Microelectronics" Van Nostrand Reinhold 1971 pp. 86-94.
Wittmer, "Mechanical Properties of Liquid Phase Bonded Copper Ceramic Substrates" J. of Amer Cer. Soc. vol. 65 No. 3 pp. 149-153.
Copy of British Search Report dated Nov. 24, 1992.
Fuji Electric & Co., Ltd.
Jewik Patrick
Ryan Patrick J.
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