Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1996-08-14
1998-11-17
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 20, 216 34, B44C 122
Patent
active
058371559
ABSTRACT:
An insulating resin composition for the build-up of multilayer circuits by the procedure of copper foil lamination and a method for the production of a multilayer printed circuit board by the use of the insulating resin composition are disclosed. The insulating resin composition comprises at least one species of epoxy resin having a softening point of not more than 110.degree. C., a monomer or an oligomer possessing an unsaturated double bond, an epoxy resin curing agent, and a photopolymerization initiator. The insulating resin composition is applied to a printed circuit board throughout the entire area thereof so as to cover conductor patterns formed thereon and then irradiated with UV light. Subsequently a copper foil is superposed on the applied layer of the insulating resin composition on the printed circuit board by means of a heated pressure roller to effect lamination thereof. The insulating resin composition is thermally cured to give a multilayer laminate and then the outer layer copper foil of the produced multilayer laminate is selectively etched to form a prescribed conductor pattern.
REFERENCES:
patent: 4902556 (1990-02-01), Benedikt et al.
patent: 5595858 (1997-01-01), Akama et al.
Inagaki Shoji
Takehara Eiji
Kananen Ronald P.
Powell William
Taiyo Ink Manufacturing Co., Ltd.
LandOfFree
Insulating resin composition for build-up by copper foil laminat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Insulating resin composition for build-up by copper foil laminat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulating resin composition for build-up by copper foil laminat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-880859