Insulating paste and thick-film multi-layered printed circuit us

Details Insulating paste and thick-film multi-layered printed circuit us Insulating paste and thick-film multi-layered printed circuit us

1996-04-04

1998-06-16

Lam, Cathy F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

501 20, 501 21, 501 65, B32B 300, C03C 816, C03C 802, C03C 3089

Patent

active

057667411

ABSTRACT:
An insulating paste comprises a glass component composed of SiO.sub.2, B.sub.2 O.sub.3 and K.sub.2 O as xSiO.sub.2 --yB.sub.2 O.sub.3 --zK.sub.2 O, where x, y and z (% by weight) fall within the area surrounded by points A (x=65, y=35, z=0), B (x=65, y=20, z=15), C (x=85, y=0, z=15) and D (x=85, y=15, z=0), and an organic vehicle. The insulating layer made of the paste has a low dielectric constant and excellent insulating properties.

REFERENCES:
patent: 3723790 (1973-03-01), Dumbaugh, Jr. et al.
patent: 4098949 (1978-07-01), Kosiorek
patent: 4172733 (1979-10-01), Moritsu et al.
patent: 4287260 (1981-09-01), Prall
patent: 4812422 (1989-03-01), Yuhaku et al.
patent: 5403789 (1995-04-01), Kerko et al.
patent: 5447891 (1995-09-01), Spinosa et al.
patent: 5480846 (1996-01-01), Sundberg et al.

Affiliated with

Also associated with

Rating

Insulating paste and thick-film multi-layered printed circuit us does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Insulating paste and thick-film multi-layered printed circuit us, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulating paste and thick-film multi-layered printed circuit us will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1722912