Insulating material with low thermal conductivity, formed of a c

Details Insulating material with low thermal conductivity, formed of a c Insulating material with low thermal conductivity, formed of a c

1977-08-05

1979-06-26

Ives, P. C.

Stock material or miscellaneous articles

Sheet including cover or casing

Complete cover or casing

428402, 428447, 264332, 62529, 52 3, 13 35, 110336, 432 65, B32B 904

Patent

active

041593596

ABSTRACT:
Insulating material, of compacted structure and of low thermal conductivity, is formed of silica-based primary particles; it is obtained by heat treatment of a compound of silane, of which the mean diameter is at most equal to 100 A; the apparent density .rho.a expressed in g/cc is between 6.10.sup.-3 and 2.3.10.sup.-3 d, d being the mean diameter of the primary particles expressed in A; in addition, this apparent density is at most equal to two thirds of the density of the solid material.
This material is applicable as a thermal insulator in the field involving low temperatures and high temperatures and in the building sector.

REFERENCES:
patent: 3151365 (1964-10-01), Glaser et al.
patent: 3962014 (1976-06-01), Hughes et al.

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