Insulating material for wiring substrate and method of producing

Electric heating – Metal heating – By arc

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21912182, 21912185, B23K 2600

Patent

active

053491556

ABSTRACT:
This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.

REFERENCES:
patent: 4784901 (1988-11-01), Hatakeyama et al.
patent: 4915981 (1990-04-01), Traskos et al.
patent: 5034801 (1991-07-01), Fischer
patent: 5063280 (1991-11-01), Inagawa et al.
Nikkei Micro-Device, Dec., 1989, pp. 50-55.
Chemtronics, vol. 4, Sep. 1989, Guilford GB, pp. 149-152, XP85761 Bachman "Excimer Lasers in a Fabrication Line for a Highly Integrated Printed Circuit Board".
European Search Report dated May 17, 1993.

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