Insulating material for printed circuit board

Details Insulating material for printed circuit board Insulating material for printed circuit board

2007-09-21

2009-11-17

Visconti, Geraldina (Department: 1795)

Compositions

Liquid crystal compositions

C428S323000, C428S480000

Reexamination Certificate

active

07618553

ABSTRACT:
Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

REFERENCES:
patent: 2008/0212299 (2008-09-01), Kim et al.
patent: 4-161461 (1992-06-01), None
patent: 9-118562 (1997-05-01), None
patent: 2003-342478 (2003-12-01), None
patent: 2006-176564 (2006-07-01), None
Japanese Office Action issued on Mar. 24, 2009 in corresponding Japanese Patent Application 2007-249849.
Japanese Patent Office Action, mailed Aug. 12, 2008 and issued in corresponding Japanese Patent Application No. 2007-249849.

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