Insulating material containing cycloolefin polymer

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

Reexamination Certificate

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C428S220000, C428S476300, C427S098300, C427S099400, C427S385500, C156S307100, C524S553000, C525S285000, C525S289000, C525S326100, C525S387000, C526S281000

Reexamination Certificate

active

10772181

ABSTRACT:
An insulating material comprising a cycloolefin polymer, specifically, an interlayer insulating material for a high-density assembly board having interlayer-connecting via holes at most 200 μm in diameter, comprising a cycloolefin polymer containing at least 50 mol % of a repeating unit derived from a cycloolefin monomer; a dry film formed from a curable resin composition comprising a polymer having a number average molecular weight within a range of 1,000 to 1,000,000 as measured by gel permeation chromatography, and a hardener; and a resin-attached metal foil obtained by forming a film of a cycloolefin polymer on one side of a metal foil. Laminates, multi-layer laminates and build-up multi-layer laminates making use of these materials, and production processes thereof.

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Kiyoshi Takagi, “Trend of MCM Assembly Boards in Recent Years,”Journal of Circuit Assembly Society,vol. 11, No. 5, 1996.

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