Insulating glass body with electrical feedthroughs and method of

Details Insulating glass body with electrical feedthroughs and method of Insulating glass body with electrical feedthroughs and method of

1986-06-03

1987-03-03

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29852, 65102, 65105, 65106, 65112, 65 301, 65 604, 156150, 156629, 156644, 156901, 204 141, 204 26, 204 384, 219121LK, 219121LL, 427 98, H05K 342

Patent

active

046474765

ABSTRACT:
A glass wafer having high aspect ratio holes passing therethrough is provided with metal conductors in the holes as feedthroughs. First, the wafer is processed to line the holes with a thin electron-conducting layer of metal. Next, a layer of the same or different metal is applied over the first metal layer providing the requisite feedthrough electrical conductivity for each hole. Preferably, the glass contains lead oxide, the first metal layer is lead and the next layer is copper.

REFERENCES:
patent: 3421915 (1969-01-01), Letter
patent: 3798136 (1974-03-01), Olsen et al.
patent: 4441008 (1984-04-01), Chan
patent: 4473737 (1984-09-01), Anthony
patent: 4521262 (1985-06-01), Pellegrino

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