Insulating foam of low thermal conductivity and method of prepar

Details Insulating foam of low thermal conductivity and method of prepar Insulating foam of low thermal conductivity and method of prepar

1993-12-22

1995-02-14

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521 92, 521123, 521130, 521155, 4283055, 4283144, 4283197, 4283227, C08J 912

Patent

active

053896955

ABSTRACT:
Low thermal conductivity insulation for refrigerators and the like is produced by blowing a resinous foam in an inert (e.g., nitrogen) atmosphere with a mixture of carbon dioxide and a low thermal conductivity inert gas such as krypton or xenon. The foam is then sealed in a gas-impervious enclosure and carbon dioxide is removed therefrom, typically by inclusion in said enclosure of a solid material reacted therewith such as an alkaline reagent. The final partial pressure of the low thermal conductivity gas in the enclosure is in the range of about 20-200 torr, and the total pressure is up to 110% of said partial pressure.

REFERENCES:
patent: 4110268 (1978-08-01), Longley
patent: 4176218 (1979-11-01), Demon et al.
patent: 4469820 (1984-09-01), Dexheimer et al.
patent: 4686240 (1987-08-01), Bailey, Jr. et al.
patent: 4999383 (1991-03-01), Blount
patent: 5110834 (1992-05-01), Horn
patent: 5286429 (1994-02-01), Blyther et al.
patent: 5302624 (1994-04-01), Reedy et al.
Griffith et al., "Gas-Filled Panel High-Performance Thermal Insulation", Lawrence Berkeley Lab., Apr. 1991.

Affiliated with

Also associated with

Rating

Insulating foam of low thermal conductivity and method of prepar does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Insulating foam of low thermal conductivity and method of prepar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Insulating foam of low thermal conductivity and method of prepar will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-288720