Insulating electromagnetic shielding resin composition

Details Insulating electromagnetic shielding resin composition Insulating electromagnetic shielding resin composition

1989-05-10

1990-10-16

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 252518, 252519, 252520, 252521, 523137, 523457, 523458, 523459, 524431, 524430, 524439, 524440, 524441, 524401, 524423, 524425, 524449, 331 84, H01B 106

Patent

active

049632914

ABSTRACT:
Filler blends of electroconductive particles with electrically non-conductive particles are provided which are useful in making electromagnetic shielding resins for encapsulating electronic devices.

REFERENCES:
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4610808 (1986-09-01), Kleiner
patent: 4696764 (1987-09-01), Yamazaki
patent: 4880570 (1989-11-01), Sanborn et al.

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