Insulating electromagnetic shielding resin composition

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252513, 252514, 252518, 252519, 252520, 252521, 523137, 523457, 523458, 523459, 524431, 524430, 524439, 524440, 524441, 524401, 524423, 524425, 524449, 331 84, H01B 106

Patent

active

049632914

ABSTRACT:
Filler blends of electroconductive particles with electrically non-conductive particles are provided which are useful in making electromagnetic shielding resins for encapsulating electronic devices.

REFERENCES:
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4610808 (1986-09-01), Kleiner
patent: 4696764 (1987-09-01), Yamazaki
patent: 4880570 (1989-11-01), Sanborn et al.

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