Insulating coating layer for electronic circuit board, insulatin

Details Insulating coating layer for electronic circuit board, insulatin Insulating coating layer for electronic circuit board, insulatin

1987-04-22

1989-04-04

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524462, C08K 502

Patent

active

048187844

ABSTRACT:
The present invention relates to an insulating coating material for an electronic circuit board, an insulating coating layer for an electronic circuit board, and a method for forming such insulating coating layer, and the insulating coating material is a solution comprising a thermoplastic resin and a solvent containing a low boiling solvent, which solution can be prevented from dropping after its application onto the electronic circuit board, and the insulating coating layer is formed using the coating material on the surface of the electronic circuit board having edge portions thereon so that the coating thickness at the edge portions and that at the other portion than the edge portions are almost equal to each other, further, the method for forming such insulating coating layer is characterized by forming the coating layer using the above insulating coating material according to a spray method or a dipping method.

REFERENCES:
patent: 2718511 (1955-09-01), Sprung et al.
patent: 3126358 (1964-03-01), Lemmerich
patent: 3533977 (1970-10-01), Read
patent: 3564088 (1971-02-01), Woodell
patent: 3740369 (1973-06-01), Proskow
patent: 3962171 (1976-06-01), Robbins

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