Insulating arrangement for optical insulation of integrated comp

Details Insulating arrangement for optical insulation of integrated comp Insulating arrangement for optical insulation of integrated comp

1989-01-27

1990-05-29

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Laterally noncoextensive components

428615, 428620, 428642, 2505781, 357 17, 357 30, B32B 1500

Patent

active

049295152

ABSTRACT:
An isolating arrangement for isolating a portion of a substrate from the remaining portions of the substrate, characterized by the arrangement comprising a pair of obliquely extending slots which merge with each other in the interior of the substrate to isolate a portion or region of the substrate from the remaining portion, except at least one end of the portion extending between the slots. The slots are preferably formed by a laser-induced, wet-chemical etching and, subsequent to forming the slots, they can be filled with a material, such as metal or a ternary absorber material, to increase the isolation of the substrate region or portion.

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Bornholdt et al., "Waveguide-Integrated Pin Photodiode On InP", Electronics Letters, vol. 23, No. 1, 2nd Jan. 1987, pp. 2-4.
Lum et al., "Improvement in The modulation Amplitude of Submicron Gratings Produced in n-InP by Direct Photoelectrochemical Etching", Applied Physics Letter, vol. 47, No. 3, 1 Aug. 1985, pp. 269-271.
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