Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-08-06
2000-02-29
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29840, 29843, H05K 336, H05K 334, H05K 300
Patent
active
060293438
ABSTRACT:
A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.
REFERENCES:
patent: 4546410 (1985-10-01), Kaufman
patent: 4865719 (1989-09-01), Butt
patent: 4876588 (1989-10-01), Miyamoto
patent: 5158912 (1992-10-01), Kellerman et al.
patent: 5159750 (1992-11-01), Dutta et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5309024 (1994-05-01), Hirano
patent: 5331510 (1994-07-01), Ouchi et al.
patent: 5615087 (1997-03-01), Wieloch
Allen-Bradley Company LLC
Echols P. W.
Horn John J.
Miller John M.
Ziebert Joseph N.
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