Insulated lead frame using plasma sprayed dielectric

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Details

357 80, H01L 2348, H01L 2350

Patent

active

050879626

ABSTRACT:
An electrically insulated lead frame having high thermal conductivity is achieved by utilizing a plasma spraying technique to apply a thin layer of a dielectric material on a surface of a lead frame. The lead frame is subsequently employed as a part of an insulated semiconductor device package.

REFERENCES:
patent: 4549194 (1985-10-01), Calviello
patent: 4604643 (1986-08-01), Yotsumoto et al.
patent: 4916518 (1990-04-01), Yoshimura
patent: 4994411 (1991-02-01), Naito et al.

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