Patent
1991-02-25
1992-02-11
Hille, Rolf
357 80, H01L 2348, H01L 2350
Patent
active
050879626
ABSTRACT:
An electrically insulated lead frame having high thermal conductivity is achieved by utilizing a plasma spraying technique to apply a thin layer of a dielectric material on a surface of a lead frame. The lead frame is subsequently employed as a part of an insulated semiconductor device package.
REFERENCES:
patent: 4549194 (1985-10-01), Calviello
patent: 4604643 (1986-08-01), Yotsumoto et al.
patent: 4916518 (1990-04-01), Yoshimura
patent: 4994411 (1991-02-01), Naito et al.
deVos James W. G.
Ommen Denise M.
Palmer Robert H.
Barbee Joe E.
Clark S. V.
Hille Rolf
Motorola Inc.
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