Insulated gate bipolar transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – Including additional component in same – non-isolated structure

Reexamination Certificate

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Details

C257S124000, C257S288000, C257S370000, C257S587000, C257S712000

Reexamination Certificate

active

07973387

ABSTRACT:
An insulated gate bipolar transistor includes bump pad connectors to provide thermal contact with a heat spreader for dissipating heat away form the insulated gate bipolar transistor.

REFERENCES:
patent: 2002/0023341 (2002-02-01), Lorenz et al.
patent: 2003/0106924 (2003-06-01), Nobori et al.
patent: 2005/0146027 (2005-07-01), Kondou et al.
patent: 2007/0057284 (2007-03-01), Casey et al.
patent: 2007/0215903 (2007-09-01), Sakamoto et al.
patent: 1005083 (2000-05-01), None
patent: 2786657 (2000-06-01), None
patent: 2814907 (2002-04-01), None
Gillot C et al., “Double-Sided Cooling for High Power IGBT Modules Using Flip Chip Technology”, Industrial Applications Conference, 2000. Conference Record of the 2000 IEEE Oct. 8-12, 2000, Piscataway, NJ, USA, IEEE, vol. 5, Oct. 8, 2000, pp. 3016-3020, XP010521716.
International Search Report and Written Opinion mailed on Sep. 18, 2008.

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