Insulated bonding wire tool for microelectronic packaging

Details Insulated bonding wire tool for microelectronic packaging Insulated bonding wire tool for microelectronic packaging

2006-01-31

2006-01-31

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500, C427S117000

Reexamination Certificate

active

06991147

ABSTRACT:
A method for insulating a bonding wire that includes the steps of attaching a bonding wire to a bond pad and coating the bonding wire with an insulating liquid while drawing the bonding wire through a bond tool from the bond pad to a package lead.

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