Installation of surface mount components on printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29847, 2281802, H05K 334

Patent

active

049379348

ABSTRACT:
Movement of surface mount components during soldering onto TEFLON.TM. printed wiring boards is prevented by applying a strip of solder mask material to a solder pad to define a component lead area and applying solder to areas of the areas of the solder pad not covered by the solder mask strip. Solder paste is applied to the component bad area and the surface mount component is positioned with a lead in registry with the component lead area. The entire board is then heated to mechanically and electrically adhere the component lead to the pad.

REFERENCES:
patent: 3778530 (1973-12-01), Reimann
patent: 3887760 (1975-06-01), Krieger et al.
patent: 4591659 (1986-05-01), Leibowitz
patent: 4617729 (1986-10-01), Celnik
patent: 4638938 (1987-01-01), Yarne et al.
patent: 4806200 (1989-02-01), Larson et al.

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