Installation of a semiconductor chip on a glass substrate

Details Installation of a semiconductor chip on a glass substrate Installation of a semiconductor chip on a glass substrate

1977-08-10

1980-02-26

Wojciechowicz, Edward J.

357 55, 357 72, 357 73, H01L 3902

Patent

active

041908554

ABSTRACT:
A flipchip LSI is mounted on a glass substrate through the use of bonding techniques. An insulating layer made of, for example, epoxy resin is formed between the LSI chip and the glass substrate in such a manner that the insulating layer is fixed to both of the LSI chip and the glass substrate. The insulating layer functions to absorb strain caused by differences of the coefficient of thermal expansion of the LSI chip and the glass substrate, thereby securing stable operation of the LSI chip.

REFERENCES:
patent: 3653959 (1972-04-01), Kehr
patent: 3691628 (1972-09-01), Kim et al.
patent: 4001871 (1977-01-01), Tsunemitsu

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