Installation for improving chemical-mechanical polishing operati

Details Installation for improving chemical-mechanical polishing operati Installation for improving chemical-mechanical polishing operati

1998-11-25

2000-09-12

Morgan, Eileen P.

Abrading

Machine

Rotary tool

451287, 451288, 451446, B24B 100

Patent

active

061169919

ABSTRACT:
A chemical-mechanical polishing station comprises a polishing table that has concentric rings. The rings are separated from each other by a small gap and all rings are capable of rotating in the same prescribed direction. A polishing pad is mounted on top of each ring, and a delivery tube is positioned at a distance above the polishing pads. The delivery tube further includes a tube handle and a tube surface, and the tube surface has a plurality of holes drilled in it for delivering slurry to the polishing pad surface. Each concentric ring of the polishing table is able to rotate such that all the rings have the same tangential polishing speed. Therefore a wafer surface can be more uniformly polished. Moreover, material having different density, roughness and chemical composition can be chosen to fabricate the polishing pads so that an even better polishing result can be obtained.

REFERENCES:
patent: 5435772 (1995-07-01), Yu
patent: 5503590 (1996-04-01), Saitoh et al.
patent: 5503592 (1996-04-01), Neumann
patent: 5558563 (1996-09-01), Cote et al.
patent: 5769699 (1998-06-01), Yu
patent: 5904609 (1999-05-01), Fukuroda et al.
patent: 5913713 (1999-06-01), Cheek et al.
patent: 5931719 (1999-08-01), Nagahara et al.
patent: 5944583 (1999-08-01), Cruz et al.

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