Inspection system for pellicalized reticles

Photocopying – Projection printing and copying cameras – Methods

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355 53, G03B 2732

Patent

active

046377140

ABSTRACT:
A method of detecting defects in a reticle used to fabricate semiconductor circuits by enhancing the image of a defect in one chip site without appreciably changing all other chip site images. In a step-and-repeat alignment system, a first chip site is exposed under normal intensities to print the reticle pattern at a proper exposure level. At a second chip site, exposure takes place using the same reticle (or a second identical reticle) at lower intensity levels. Given this underexposure, residual photoresist will remain at defect sites. The optical imagery at the two chip sites is different allowing comparator techniques to be used.

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patent: 4416539 (1983-11-01), Tereshita
patent: 4443096 (1984-04-01), Johannsmeier et al.
patent: 4577961 (1986-03-01), Tereshita

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