Inspection system and method for bond detection and validation o

Image analysis – Applications – Manufacturing or product inspection

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382146, 382147, 374 10, 250332, G01N 2572, G01N 2171, G06T 520

Patent

active

059636629

ABSTRACT:
A hybrid surface mount component inspection system which includes both vision and infrared inspection techniques to determine the presence of surface mount components on a printed wiring board, and the quality of solder joints of surface mount components on printed wiring boards by using data level sensor fusion to combine data from two infrared sensors to obtain emissivity independent thermal signatures of solder joints, and using feature level sensor fusion with active perception to assemble and process inspection information from any number of sensors to determine characteristic feature sets of different defect classes to classify solder defects.

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