Inspection probe having thin metal wires with self resiliency

Details Inspection probe having thin metal wires with self resiliency Inspection probe having thin metal wires with self resiliency

1991-03-08

1992-09-29

Nguyen, Vinh

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 725, 324158F, G01R 3102

Patent

active

051516535

ABSTRACT:
An inspection probe which allows a plurality of such inspection probes to be arranged at a remarkably reduced pitch. The inspection probe comprises a very thin metal wire having a diameter of 120 .mu.m or less and so shaped as to have self resiliency, and a plated noble metal layer formed on a surface of the very thin wire. A probe pin head for the inspection of an electronic circuit board is constructed employing a plurality of such inspection probes. The inspection probes are secured to or embedded in a base made of a resin material. A process of producing the probe pin head is also disclosed.

REFERENCES:
patent: 3731191 (1973-05-01), Bullard et al.
patent: 4980638 (1990-12-01), Dermon et al.
patent: 5015947 (1991-05-01), Chism
Lipschutz et al.; "Buckling Wire Probe Assembly"; IBM Technical Disclosure Bulletin, vol. 15, No. 10, Mar. 1973.

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