Inspection pattern, inspection method, and inspection system...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C257S048000, C257SE21521, C438S014000

Reexamination Certificate

active

07081758

ABSTRACT:
An inspection pattern, an inspection method, and an inspection system for detection of a latent defect of a multi-layer wiring structure formed on the semiconductor wafer. The inspection pattern includes lower-layer wiring portions, upper-layer wiring portions, an insulating layer provided between them, contact units connecting them to form a contact chain, and electrode terminals. The inspection method includes the steps of acquiring an applied-voltage versus measured-current characteristic or an elapsed-time versus measured-voltage characteristic of the inspection pattern, and judging presence or absence of a latent defect of the inspection pattern on the basis of the acquired characteristic. The inspection system includes a voltage-applying/current-measuring device or a constant-current-feeding/voltage-measuring device, and a judging device for judging presence or absence of a latent defect of the inspection pattern.

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patent: 5712510 (1998-01-01), Bui et al.
patent: 5900735 (1999-05-01), Yamamoto
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patent: 6825671 (2004-11-01), Zhang
patent: 6842028 (2005-01-01), Song et al.
patent: 10-135297 (1998-05-01), None
patent: 10-135298 (1998-05-01), None
patent: 10-341079 (1998-12-01), None
patent: 2000-232144 (2000-08-01), None

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