Inspection of solder joints by acoustic impedance

Measuring and testing – Vibration – Resonance – frequency – or amplitude study

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G01H 1300

Patent

active

042877660

ABSTRACT:
A method for detection of unacceptable solder joints, especially solder pads on printed circuit boards (PCBs), by means of the application of acoustic vibrations over a range of frequencies to the solder joint and observation of the acoustic impedance of the joint as reflected back through the driver to the acoustic generator or through an acoustic detector near the generator to electrical detecting apparatus.

REFERENCES:
patent: 3106838 (1963-10-01), Crooks
patent: 3857279 (1974-12-01), Salzer et al.
patent: 4090400 (1978-05-01), Vahaviolos

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