Inspection of multilayer ceramic circuit modules by electrical i

Details Inspection of multilayer ceramic circuit modules by electrical i Inspection of multilayer ceramic circuit modules by electrical i

1984-02-16

1986-03-25

Morgenstern, Norman

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

427 96, 4271262, 4273835, 324 51, 324 73PC, G01R 3102

Patent

active

045782792

ABSTRACT:
A method of manufacturing packages for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the green sheets, and inspecting the green sheets optically. Here, subsets of green sheets are then stacked and compressed into sublaminates. The sublaminates are then functionally inspected electrically. Inspection is done by means of electromechanical contact, scanning electron microscope like techniques, or by other means of irradiating the conductors to energize them for electrical measurement. Measurement may be made between pairs of terminals on only one side of the device being tested, or on both sides of the device. Beams can be applied both top and bottom from a single source or plural sources. Measuring instruments employ various electromechanical techniques as well as electrons, light used photoelectrically, ions, or pneumatic ion jets. Secondary electrons can measure the specimen's potential locally or change its charge. This method can also be employed for the purpose of inspecting other multilayer structures (such as large multilayer printed circuits formed on a plastic base) prior to final assembly of the conductors and the various substrates into a laminated support for electrical circuits. This testing process can also be applied after firing of patterned green sheets prior to plating, as well as after plating.

REFERENCES:
patent: 4056716 (1977-11-01), Baxter et al.

Affiliated with

Also associated with

Rating

Inspection of multilayer ceramic circuit modules by electrical i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inspection of multilayer ceramic circuit modules by electrical i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inspection of multilayer ceramic circuit modules by electrical i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-630012