Inspection method of conductive patterns

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

324761, G01R 1512

Patent

active

061604097

ABSTRACT:
An inspection apparatus inspects an electronic circuit board on which a plurality of bonding pads and a plurality of pin pads are connected to each other through conductive patterns. A probe having a contact pin is moved on the electronic circuit board along a straight line substantially constituted by a terminal group without separating the contact pin from the surface of the electronic circuit board. This moving operation is a "wiping" operation. In the process of movement, an identifiable electrical signal is applied to the contact pin, and a return signal is detected at each pin pad. This return signal is compared with a reference signal obtained in advance by using a reference circuit board. A discontinuity or short in each conductive pattern is determined on the basis of the comparison result.

REFERENCES:
patent: 3562543 (1971-02-01), Smith
patent: 4035722 (1977-07-01), Ryabov et al.
patent: 4138643 (1979-02-01), Beck et al.
patent: 4342957 (1982-08-01), Russell
patent: 4342958 (1982-08-01), Russell
patent: 4471298 (1984-09-01), Frohlich
patent: 4565966 (1986-01-01), Burr et al.
patent: 5003254 (1991-03-01), Hunt et al.
patent: 5006808 (1991-04-01), Watts
patent: 5214375 (1993-05-01), Ikeuchi et al.
patent: 5256975 (1993-10-01), Mellitz et al.
patent: 5357191 (1994-10-01), Grace
patent: 5408189 (1995-04-01), Swart et al.
patent: 5420500 (1995-05-01), Kerchner
patent: 5461323 (1995-10-01), Yanagi et al.
patent: 5461324 (1995-10-01), Boyette et al.
patent: 5467020 (1995-11-01), Boyette, Jr. et al.
patent: 5596283 (1997-01-01), Mellitz et al.
Patent Abstracts of Japan, vol. 014, No. 136, Mar. 14, 1990, Abstract No. 02-002946.
Patent Abstracts of Japan, vol. 014, No. 430, Sep. 14, 1990, Abstract No. 02-168164.
Patent Abstracts of Japan, vol. 015, No. 312, Aug. 9, 1991, Abstract No. 03-113375.
Patent Abstracts of Japan, vol. 096, No. 011, Nov. 29, 1996, Abstract No. 08-189939.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Inspection method of conductive patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inspection method of conductive patterns, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inspection method of conductive patterns will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-221408

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.