Inspection method and inspection apparatus

Details Inspection method and inspection apparatus Inspection method and inspection apparatus

2006-06-13

2006-06-13

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S757020

Reexamination Certificate

active

07061259

ABSTRACT:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

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Mark Beiley, et al. “A Micromachined Array Probe Card-Characterization” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, vol. 18, No. 1, Feb., 1995 pp. 184-191.

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