Inspection method and inspection apparatus

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S757020

Reexamination Certificate

active

07061259

ABSTRACT:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.

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patent: 64-048038 (1989-02-01), None
patent: 11-242062 (1999-09-01), None
Mark Beiley, et al. “A Micromachined Array Probe Card-Characterization” IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, vol. 18, No. 1, Feb., 1995 pp. 184-191.

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