Inspection method and device of wafer surface

Details Inspection method and device of wafer surface Inspection method and device of wafer surface

1996-04-08

1999-05-11

Pham, Hoa Q.

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

3562375, 3562398, 25055941, G01N21/88

Patent

active

059033428

ABSTRACT:
A wafer surface inspection method and device including a low angle light receiving system having an elevation angle less than 30.degree. with reference to the wafer surface, and a high angle light receiving system having an elevation angle equal to or larger than 30.degree., scans the wafer with a laser beam, receives scattered light to perform extraneous substance detection in response to the scanning, and detects wafer defects only by the high angle light receiving system, and sticking extraneous substances by either the low angle receiving system or by both the low angle light receiving system and the high angle light receiving system.

REFERENCES:
patent: 4610541 (1986-09-01), Tanimoto et al.
patent: 4889998 (1989-12-01), Hayano et al.
patent: 4966457 (1990-10-01), Hayano et al.
patent: 5245403 (1993-09-01), Kato et al.
patent: 5293538 (1994-03-01), Iwata et al.

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