Inspection for alignment between IC die and package substrate

Details Inspection for alignment between IC die and package substrate Inspection for alignment between IC die and package substrate

2006-04-18

2006-04-18

Pham, Toan N. (Department: 2632)

Communications: electrical

Condition responsive indicating system

Specific condition

C340S686200, C340S686400, C438S401000, C438S975000, C257S797000

Reexamination Certificate

active

07030772

ABSTRACT:
In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.

REFERENCES:
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patent: 6410415 (2002-06-01), Estes et al.
patent: 6638831 (2003-10-01), Roberts et al.

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