Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2003-08-05
2008-07-29
Le, Brian Q (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C382S147000, C382S148000, C382S151000, C382S152000
Reexamination Certificate
active
07406191
ABSTRACT:
After a CAD data and a parts library are combined to produce an inspection data, the set data for the inspection window is automatically corrected using the image of a bare board for a board to be inspected. In this correcting process, an inspection window based on the aforementioned inspection data is set on a bare board image, and then an image in the inspection window W4making up a reference for setting other windows is binarized, and lands35on this binary image are detected. Further, on the basis of the detection result, the set position and size of land windows W1for solder inspection are corrected, after which the set positions of other inspection windows W2to W4are corrected.
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Fujii Yoshiki
Sugiyama Toshiyuki
Foley & Lardner LLP
Le Brian Q
Omron Corporation
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