Inspection data analysis program, inspection tools, review...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation

Reexamination Certificate

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C438S014000, C700S108000

Reexamination Certificate

active

07421357

ABSTRACT:
An operation unit executes a process for calling to a main memory first data representative of a result of equipment QC applied to a production unit. A process for reading out to the main memory an amount of change in failure in accordance with particle numbers calculated for individual defect sizes from second inspection data representative of a result of equipment QC is applied to the production unit. Electrical test data of a product processed by the production unit during a period inclusive of the time that the second inspection is carried outis also read to the main memory. A process is also executed for using the amount of change in failure in accordance with the calculated particle numbers and the particle numbers for individual sizes determined from the first inspection data to determine an impact on the product by particles generated in the production equipment when the first inspection data is detected.

REFERENCES:
patent: 6128403 (2000-10-01), Ozaki
patent: 6150023 (2000-11-01), Yasaka et al.
patent: 6289257 (2001-09-01), Sekine
patent: 6314379 (2001-11-01), Hu et al.
patent: 6341241 (2002-01-01), Mugibayashi et al.
patent: 2002/0002415 (2002-01-01), Mugibayashi et al.
patent: 2002/0183889 (2002-12-01), Sakakibara
patent: 2002-299401 (2002-10-01), None
“Non-Defective Area Analysis for Quantifying Yield Impact”, by M. Ono, et al, 1999, IEEE International Symposium on Semiconductor Manufacturing, Proceedings, pp. 127-130.
European Search Report dated Feb. 3, 2006.
Ono, Makoto, et al., Non-Defective Area Analysis for Quantifying Yield Impact, Semiconductor Manufacturing Conference Proceedings, 1999 IEEE International Symposium on Santa Clara, CA, USA, Oct. 11, 1999, pp. 127-130, Piscataway, NJ.

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